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PCB plating production line

Copper plating equipment for crystal coated film

1. The new generation of packaging technology COF (Chip On Flex or Chip On Film) packaging has become one of the main ways to package flat panel display driver ICs because it meets the development trend of short, light and thin. The copper plating method is that after the polyimide film undergoes various pretreatments, copper or other metals are sputtered on the film to form a thin conductive layer, and then the copper layer is formed by wet electroplating.
2. Production conditions

project Details
Equipment installation environment temperature [°C] normal temperature
Humidity [%] General ambient humidity
Installation location meet equipment placement
Equipment energy requirements Rated voltage 3-phase 3-wire type 380V (electric cabinet and fire cow are equipped with independent switches respectively)
Rated frequency 50Hz 
rated power           KW
Power outage protection       PC computer comes with ups after being powered
compressed air 5.0 ~ 6. 0 kgf/?
CW Water Supply pressure: 1.0 ~ 2.5 kgf/? ,
Supply temperature: 14 ~ 22℃ (seasonal difference occurs)
Dosage: 1000L/Hr
cold water Supply pressure: 1.0 ~ 3. 0 kgf/?
Supply temperature: 7 ~ 11℃ 
DI Water Supply pressure: 1.0 ~ 2. 0 kgf/? ,
Available within 60 minutes
exhaust The medicine tank and the copper tank have ventilation by the side of the tank, and the overall environment is exhausted.
Suction flow rate: 5~8Meter /sec  
drain Waste liquid: copper sulfate wastewater (UPVC pipe diameter daily gauge Dia2"), comprehensive wastewater (UPVC pipe diameter daily gauge Dia2").
The drainage time in the tank is less than 60 minutes
Water and electricity in place Provided by the customer for various needs, the pipeline is connected to the equipment within 1 meter.
Appearance of the device device size  (L)22000mm * (W)4900mm * (H)4000mm
Equipment weight (kg) ( )
Basic Specifications input direction Provided by customer □ Left → Right □ Right→ Left  
device color Color: Rack stainless steel natural color. Electric cabinet off-white.
Consult with the person in charge when using colors other than basic colors
Pass Line □ Lower Space 280mm (plating equipment)
language used Traditional Chinese or Simplified Chinese.
HMI: Simplified Chinese
Safety confirmation Various warning slogans, hardware emergency switches, safety ropes, and transmission mechanisms are all covered with safety.








3. Circuit board specifications







No project details
1 Board size 250 * 200mm (standard)
2 Board thickness Min 0.04mm ~ Max 1.0mm
3 hole size Min Φ0.05mm ~ Max Φ1.0mm
Through hole AR 6 : 1 (90%); Blind hole AR 1 : 2 (80%)


4. Quality specifications

No project details
1 Average Thickness Requirements 12? 
COV≦6%
2 Test method for thickness of copper plating on board Measurement position: according to the picture, each side is equidistant to 15 points (except for the side, up, down, left and right 20mm) 
Measurement quantity: 30 point/pnl(15point/side), 6pnl measurement
→ Total 180 point measurement
Measuring machine plate: 250mm × 200mm
Assay method: Micro Section
Thickness deviation: ±10 %
3 Through hole capability Measurement place: 5 points as shown in the picture (except for the 20mm up and down, left and right)
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 Number of measurements: 5 points/pnl, 3pnl measurements→ Total section
 Measuring machine version: 250mm × 200mm   　
(including 0.075Φ, 0.10Φ, 0.15 board) 　
 Determination method: Slice observation of each point. 　
 Through hole capability: ±100 % (see table below for details) 　
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  · Minimum through hole φ: 0.25mm   　
  · Maximum plate thickness: 1.0mm   　
  · Maximum aspect ratio = 6.4 : 1   　
Through hole calculation:     　
Hole Plating Thickness (5~10 Min) / Surface Thickness (1~4 Average) × 100%